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Ansys Electronics accelerates product development by reducing testing costs and enabling first‑pass success through accurate, high‑fidelity EM, SI/PI, thermal, and electro-mechanical simulation on a unified design platform.
Key Tools and Features
Ansys HFSS: A 3D high-frequency electromagnetic field solver used for antennas, RF/microwave components, and high-speed printed circuit boards (PCBs).
Ansys Maxwell: An electromagnetic finite element analysis (FEA) solver used to design and analyze electric machines, motors, actuators, and transformers.
Ansys Icepak: A computational fluid dynamics (CFD) tool for managing heat dissipation and airflow in electronics assemblies and power packages.
Ansys Q3D Extractor: Calculates parasitic parameters (RLCG—resistance, inductance, capacitance, conductance) for power and signal integrity analysis.
